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1-9 of 9
Ashwin Siddarth
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Proceedings Papers
Pardeep Shahi, Ali Heydari, Pratik Bansode, Ashwin Siddarth, Uschas Chowdhury, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114351
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
Published Online: April 10, 2019
Proceedings Papers
Proc. ASME. IMECE2018, Volume 6A: Energy, V06AT08A053, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-88502
Proceedings Papers
Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-88497
Proceedings Papers
Hemanth N. Dakshinamurthy, Ashwin Siddarth, Abhishek Guhe, Rajesh Kasukurthy, James Hoverson, Dereje Agonafer
Proc. ASME. IMECE2018, Volume 13: Design, Reliability, Safety, and Risk, V013T05A049, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-88508
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
Proceedings Papers
Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al Khazraji, Jimil Shah, Ashwin Siddarth, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8378
Proceedings Papers
Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74028
Journal Articles
Richard Eiland, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, Verrendra Mulay
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041005.
Paper No: EP-17-1020
Published Online: September 7, 2017