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Journal Articles

Dynamic Crushing of All-Metallic Corrugated Panels Filled With Close-Celled Aluminum Foams

B. Yu, B. Han, C. Y. Ni, Q. C. Zhang, C. Q. Chen, T. J. Lu
Journal: Journal of Applied Mechanics
Article Type: Research-Article
J. Appl. Mech. January 2015, 82(1): 011006.
Paper No: JAM-14-1152
DOI: https://doi.org/10.1115/1.4028995
Published Online: January 1, 2015
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Topics: Compression, Density, Struts (Engineering), Aluminum, Foams (Chemistry), Deformation, Buckling
Proceedings Papers

Application of Thermoelectric Waste Heat Recovery From Automobiles

C. T. Hsu, D. J. Yao, B. Yu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 405-409, December 18–21, 2009
Paper No: MNHMT2009-18144
DOI: https://doi.org/10.1115/MNHMT2009-18144
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Topics: Automobiles, Exhaust systems, Generators, Heat recovery
Proceedings Papers

Effect of Viscoelasticity on the Turbulence Kinetic Energy Budget of the Non-Newtonian Fluid Turbulent Flow Accompanied by Drag Reduction

Y. Kagawa, B. Yu, Y. Kawaguchi
Proc. ASME. FEDSM2007, Volume 1: Symposia, Parts A and B, 275-284, July 30–August 2, 2007
Paper No: FEDSM2007-37170
DOI: https://doi.org/10.1115/FEDSM2007-37170
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Topics: Drag reduction, Kinetic energy, Non-Newtonian fluids, Turbulence, Viscoelasticity
Proceedings Papers

Condensation Heat Transfer and Pressure Drop of R-134a Flowing in Annular Helical Pipes at Different Orientations

B. Yu, C. X. Lin, M. A. Ebadian, R. C. Prattipati
Proc. ASME. HT2003, Heat Transfer: Volume 2, 429-434, July 21–23, 2003
Paper No: HT2003-47236
DOI: https://doi.org/10.1115/HT2003-47236
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Topics: Condensation, Heat transfer, Pipes, Pressure drop
Proceedings Papers

Turbulent Statistics of Rarefield Flows in Microchannel Flow and Heat Transfer

G. X. Li, W. Q. Tao, Z. Y. Li, B. Yu
Proc. ASME. ICMM2004, ASME 2nd International Conference on Microchannels and Minichannels, 259-266, June 17–19, 2004
Paper No: ICMM2004-2343
DOI: https://doi.org/10.1115/ICMM2004-2343
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Topics: Flow (Dynamics), Heat transfer, Microchannel flow, Statistics as topic, Turbulence, Temperature, Heat flux, Shear stress, Computer simulation, Finite difference methods
Proceedings Papers

Low Temperature Wafer Bonding in Medium Vacuum

W. B. Yu, J. Wei, C. M. Tan, S. S. Deng
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 303-307, November 13–19, 2004
Paper No: IMECE2004-60454
DOI: https://doi.org/10.1115/IMECE2004-60454
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Topics: Bonding, Low temperature, Semiconductor wafers, Vacuum, Plasmas (Ionized gases), Temperature, Annealing, Bubbles, Contamination, Damage
Proceedings Papers

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, C. K. Wong
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 309-314, November 13–19, 2004
Paper No: IMECE2004-60455
DOI: https://doi.org/10.1115/IMECE2004-60455
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Topics: Bonding, Composite materials, Design, Hydrophilicity, Low temperature, Semiconductor wafers, Sol-gel processing
Journal Articles

An Instrumented Wheel for Kinetic Analysis of Wheelchair Propulsion

H.-W. Wu, L. J. Berglund, F.-C. Su, B. Yu, A. Westreich, K.-J. Kim, K.-N. An
Journal: Journal of Biomechanical Engineering
Article Type: Technical Briefs
J Biomech Eng. August 1998, 120(4): 533–535.
DOI: https://doi.org/10.1115/1.2798024
Published Online: August 1, 1998
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Topics: Propulsion, Wheelchairs, Wheels, Dynamic testing (Materials), Kinematics