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Baris Dogruoz
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2022, 144(10): 102101.
Paper No: HT-21-1876
Published Online: August 18, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
Published Online: October 13, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
Published Online: October 18, 2019
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8311
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
Published Online: April 19, 2016
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48094
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48024
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
Proceedings Papers
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17833
Proceedings Papers
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1515-1522, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89857
Proceedings Papers
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1381-1388, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65626
Proceedings Papers
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1389-1395, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65628
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 259-267, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52172
Journal Articles
Publisher: ASME
Article Type: Invited Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 022003.
Published Online: November 12, 2009
Proceedings Papers
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 195-206, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39245
Proceedings Papers
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 397-404, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43347
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
Published Online: July 30, 2005