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Daniel Kearney
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Proceedings Papers

Evaluation of an Integrated Micro-Cooling Chip Architecture for Managing Thermal Concerns of a Power Electronics Module

George Papadopoulos, Daniel Kearney, Daniele Torresin
Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A015, July 30–August 3, 2017
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM2017-69519
https://doi.org/10.1115/FEDSM2017-69519
View Paper titled, Evaluation of an Integrated Micro-Cooling Chip Architecture for Managing Thermal Concerns of a Power Electronics Module
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Topics: Cooling, Electronics, Additive manufacturing, Circuits, Coolants, Design, Laminates, Distributed power generation, Fluid dynamics, Heat
Proceedings Papers

Addressing Thermal Management Concerns for a Power Electronics Module Using an Integrated Micro-Cooling Chip Array Scheme

George Papadopoulos, Daniel Kearney
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A038, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53728
https://doi.org/10.1115/IMECE2015-53728
View Paper titled, Addressing Thermal Management Concerns for a Power Electronics Module Using an Integrated Micro-Cooling Chip Array Scheme
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Topics: Cooling, Electronics, Thermal management, Design, Heat exchangers, Circuits, Coolants, Flow (Dynamics), Flux (Metallurgy), Heat
Journal Articles

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Daniel Kearney, Justin Griffin
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2014, 136(8): 081401.
Paper No: HT-13-1372
https://doi.org/10.1115/1.4027131
Published Online: April 17, 2014
View Article titled, An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
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Topics: Fluids, Heat, Heat pipes, Temperature, Ethanol, Thermal resistance, Heat transfer
Proceedings Papers

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Daniel Kearney, Justin Griffin
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A012, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17009
https://doi.org/10.1115/HT2013-17009
View Paper titled, An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
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Topics: Computer cooling, Heat pipes, Heat, Fluids, Flux (Metallurgy), Electronic systems, Ethanol, Heat transfer, Power density, Surface roughness
Journal Articles

An Experimental Investigation of the Flow Fields Within Geometrically Similar Miniature-Scale Centrifugal Pumps

Daniel Kearney, Ronan Grimes, Jeff Punch
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. October 2009, 131(10): 101101.
https://doi.org/10.1115/1.3176985
Published Online: September 11, 2009
View Article titled, An Experimental Investigation of the Flow Fields Within Geometrically Similar Miniature-Scale Centrifugal Pumps
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Topics: Blades, Flow (Dynamics), Pumps, Pressure, Centrifugal pumps, Impellers, Reynolds number
Proceedings Papers

An Experimental and Theoretical Investigation of the Pumping Performance of Geometrically Similar Flow Fields Within Miniature-Scale Centrifugal Pumps

Daniel Kearney, Jeff Punch, Ronan Grimes
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 893-900, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32519
https://doi.org/10.1115/HT2007-32519
View Paper titled, An Experimental and Theoretical Investigation of the Pumping Performance of Geometrically Similar Flow Fields Within Miniature-Scale Centrifugal Pumps
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Topics: Centrifugal pumps, Cooling, Flow (Dynamics), Thermal management, Pumps, Blades, Reynolds number, Heat, Electronics, Fluids
Proceedings Papers

An Analysis of the Flow Fields Within Geometrically-Similar Miniature Scale Centrifugal Pumps

Daniel Kearney, Jeff Punch, Ronan Grimes
Proc. ASME. HT2008, Heat Transfer: Volume 2, 755-764, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56195
https://doi.org/10.1115/HT2008-56195
View Paper titled, An Analysis of the Flow Fields Within Geometrically-Similar Miniature Scale Centrifugal Pumps
Open the PDF for An Analysis of the Flow Fields Within Geometrically-Similar Miniature Scale Centrifugal Pumps in another window
Topics: Centrifugal pumps, Cooling, Electronics, Flow (Dynamics), Thermal management, Pumps, Blades, Impellers, Pressure, Reynolds number