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Fahad Mirza
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Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A009, July 6–9, 2015
Paper No: IPACK2015-48811
DOI: https://doi.org/10.1115/IPACK2015-48811
View Paper titled, Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
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Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling
Journal Articles

Control of a Powered Prosthetic Hand Via a Tracked Glove

Oguz Yetkin, Joe Sanford, Fahad Mirza, Roopak Karulkar, Sumit K. Das, Dan O. Popa
Journal: Journal of Medical Devices
Article Type: Technical Briefs
J. Med. Devices. June 2015, 9(2): 020920.
Paper No: MED-15-1113
DOI: https://doi.org/10.1115/1.4030132
Published Online: June 1, 2015
View Article titled, Control of a Powered Prosthetic Hand Via a Tracked Glove
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Topics: Artificial limbs, Computer software, Testing, Sensors, Prostheses
Journal Articles

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Fahad Mirza, Gaurang Naware, Ankur Jain, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041008.
Paper No: EP-13-1122
DOI: https://doi.org/10.1115/1.4028076
Published Online: September 19, 2014
View Article titled, Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
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Topics: Heating, Joules, Junctions, Mechanical admittance, Silicon, Temperature, Heat, Temperature distribution
Proceedings Papers

Effect of TSV Joule Heating on Device Performance

Fahad Mirza, Gaurang Naware, Thiagarajan Raman, Ankur Jain, Dereje Agonafer
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A016, July 16–18, 2013
Paper No: IPACK2013-73228
DOI: https://doi.org/10.1115/IPACK2013-73228
View Paper titled, Effect of TSV Joule Heating on Device Performance
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Topics: Electrical conductance, Heating, Joules, Mechanical admittance
Proceedings Papers

Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium

Fahad Mirza, Thiagarajan Raman, Saeed Ghalambor, Ashraf Bastawros, Dereje Agonafer
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 353-358, November 11–17, 2011
Paper No: IMECE2011-63670
DOI: https://doi.org/10.1115/IMECE2011-63670
View Paper titled, Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium
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Topics: Delays, Flip-chip, Gates (Closures), Silicon, Stress, Thermomechanics, Dielectric materials, Temperature distribution, Transistors, Adhesion
Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010
Paper No: IMECE2010-40803
DOI: https://doi.org/10.1115/IMECE2010-40803
View Paper titled, Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits