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Jürgen Wilde
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Journal Articles

Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component

Markus Tauscher, Tobias Merk, Aniket Adsule, Andreas Linnemann, Jürgen Wilde
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
DOI: https://doi.org/10.1115/1.4062404
Published Online: May 15, 2023
View Article titled, Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Solders, Cycles, Deformation
Journal Articles

Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Patrick Gaiser, Markus Klingler, Jürgen Wilde
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021011.
Paper No: EP-19-1060
DOI: https://doi.org/10.1115/1.4046619
Published Online: April 6, 2020
View Article titled, Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
Click here to open pdf in another window PDF for Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
Topics: Fracture (Materials), Simulation, Cycles
Journal Articles

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Sohaib Anees, Elena Zukowski, Michael Berndt, Jürgen Wilde, Leonhard M. Reindl
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041002.
Paper No: EP-13-1078
DOI: https://doi.org/10.1115/1.4026437
Published Online: September 19, 2014
View Article titled, Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Click here to open pdf in another window PDF for Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Topics: Sensors, Simulation, Strain gages, Strain sensors, Stress, Temperature, Cycles, Surface acoustic waves
Proceedings Papers

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Elena Zukowski, Michael Berndt, Sohaib Anees, Jürgen Wilde, Leonhard M. Reindl
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A004, July 16–18, 2013
Paper No: IPACK2013-73258
DOI: https://doi.org/10.1115/IPACK2013-73258
View Paper titled, Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Click here to open pdf in another window PDF for Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
Topics: Sensors, Surface acoustic waves, Strain sensors, Stress, Cycles, Temperature, Fatigue, Finite element methods, Finite element model, Signals
Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031002.
DOI: https://doi.org/10.1115/1.4006927
Published Online: July 18, 2012
View Article titled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Click here to open pdf in another window PDF for Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing