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Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf

J. Electron. Packag. December 2014, 136(4): 041012.

Paper No: EP-13-1130

DOI: https://doi.org/10.1115/1.4028332

Published Online: September 19, 2014

View Article titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature

Proceedings Papers

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A001, July 16–18, 2013

Paper No: IPACK2013-73092

DOI: https://doi.org/10.1115/IPACK2013-73092

View Paper titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Topics: Nanoparticles, Self-assembly, Columns (Structural), Evaporation, Particulate matter, Annealing, Bridges (Structures), Composite materials, Copper, Electronic packages

Journal Articles

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Javier V. Goicochea, Ming Hu, Bruno Michel, Dimos Poulikakos

J. Heat Transfer. August 2011, 133(8): 082401.

DOI: https://doi.org/10.1115/1.4003533

Published Online: April 26, 2011

View Article titled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Topics: Atoms, Electrical conductance, Heat, Heat transfer, Quartz, Thermal conductivity, Water, Simulation, Chain, Hydrophilicity

Proceedings Papers

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Ming Hu, Javier V. Goicochea, Bruno Michel, Dimos Poulikakos

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 791-796, August 8–13, 2010

Paper No: IHTC14-22362

DOI: https://doi.org/10.1115/IHTC14-22362

View Paper titled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Topics: Atoms, Chain, Columns (Structural), Energy dissipation, Fluids, Heat, Heat flux, Heat transfer, Hydrophilicity, Molecular dynamics

Journal Articles

Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices

Javier V. Goicochea, Marcela Madrid, Cristina Amon

J. Heat Transfer. October 2010, 132(10): 102401.

DOI: https://doi.org/10.1115/1.4001644

Published Online: July 23, 2010

View Article titled, Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices

Topics: Phonons, Relaxation (Physics), Silicon, Temperature, Thermal conductivity, Heat transfer, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Specific heat

Journal Articles

Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics

Javier V. Goicochea, Marcela Madrid, Cristina Amon

J. Heat Transfer. January 2010, 132(1): 012401.

DOI: https://doi.org/10.1115/1.3211853

Published Online: October 22, 2009

View Article titled, Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics

Topics: Phonons, Relaxation (Physics), Silicon, Temperature, Thermal conductivity, Dispersion relations, Thermal properties

Proceedings Papers

Silicon Thin Film Thermal Conductivity in Ballistic and Diffusive Regimes Predicted by Molecular Dynamics

Carlos J. Gomes, Marcela Madrid, Javier V. Goicochea, Cristina H. Amon

Proc. ASME. HT2005, Heat Transfer: Volume 4, 811-819, July 17–22, 2005

Paper No: HT2005-72434

DOI: https://doi.org/10.1115/HT2005-72434

View Paper titled, Silicon Thin Film Thermal Conductivity in Ballistic and Diffusive Regimes Predicted by Molecular Dynamics

Topics: Equilibrium (Physics), Molecular dynamics, Phonons, Silicon, Thermal conductivity, Thin films

Journal Articles

In-Plane and Out-Of-Plane Thermal Conductivity of Silicon Thin Films Predicted by Molecular Dynamics

Carlos J. Gomes, Marcela Madrid, Javier V. Goicochea, Cristina H. Amon

J. Heat Transfer. November 2006, 128(11): 1114–1121.

DOI: https://doi.org/10.1115/1.2352781

Published Online: April 6, 2006

View Article titled, In-Plane and Out-Of-Plane Thermal Conductivity of Silicon Thin Films Predicted by Molecular Dynamics

Topics: Molecular dynamics, Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Atoms, Film thickness, Equilibrium (Physics), Boundary-value problems

Journal citation

NARROW

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices

Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics

Silicon Thin Film Thermal Conductivity in Ballistic and Diffusive Regimes Predicted by Molecular Dynamics

In-Plane and Out-Of-Plane Thermal Conductivity of Silicon Thin Films Predicted by Molecular Dynamics

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