Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Publisher
Journal
Article Type
Conference Series
Subject Area
Topics
Date
Availability
1-4 of 4
Joon Seop Kwak
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98800
Journal Articles
Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031111.
Paper No: EP-20-1015
Published Online: May 13, 2020
Proceedings Papers
Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6426
Journal Articles
Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
Published Online: February 25, 2019