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Journal Articles

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
https://doi.org/10.1115/1.4002911
Published Online: December 3, 2010
View Article titled, Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
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Topics: Creep, Lead-free solders, Fatigue life, Compression, Fatigue testing, Waves, Stress
Journal Articles

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
https://doi.org/10.1115/1.4002897
Published Online: November 23, 2010
View Article titled, Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Open the PDF for Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves in another window
Topics: Creep, Deformation, Lead-free solders, Stress, Waves, Solders, Alloys
Proceedings Papers

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-Ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 107-113, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33663
https://doi.org/10.1115/IPACK2007-33663
View Paper titled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Open the PDF for Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test in another window
Topics: Lead-free solders, Creep, Alloys, Constitutive equations, Deformation, Engineering simulation, Simulation, Solders, Stress, Stress-strain relations
Proceedings Papers

Microstructural Change of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Subjected to Uniaxial Ratchetting Deformation

Katsuhiko Sasaki, Takuji Kobayashi, Ken-Ichi Ohguchi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 99-105, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33603
https://doi.org/10.1115/IPACK2007-33603
View Paper titled, Microstructural Change of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Subjected to Uniaxial Ratchetting Deformation
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Topics: Alloys, Deformation, Solders, Tin, Constitutive equations, Creep, Cycles, Dislocations, Electronic packaging, Grain size
Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
https://doi.org/10.1115/1.3103951
Published Online: March 27, 2009
View Article titled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Open the PDF for Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test in another window
Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys
Proceedings Papers

A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-Free Solder Alloys

Ken-Ichi Ohguchi, Katsuhiko Sasaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1791-1796, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73103
https://doi.org/10.1115/IPACK2005-73103
View Paper titled, A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-Free Solder Alloys
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Topics: Alloys, Constitutive equations, Lead-free solders, Creep, Tin, Deformation, Engineering simulation, Finite element methods, Finite element model, Relaxation (Physics)
Proceedings Papers

Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

Katsuhiko Sasaki, Takuji Kobayashi, Ken-Ichi Ohguchi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1773-1778, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73054
https://doi.org/10.1115/IPACK2005-73054
View Paper titled, Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys
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Topics: Alloys, Creep, Solders, Tin, Deformation, Tension, Compression, Electronic packaging, Reliability, Safety
Journal Articles

Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn ∕ 37 Pb and Sn ∕ 3 Ag ∕ 0.5 Cu Solder Alloys

Katsuhiko Sasaki, Takuji Kobayashi, Ken-ichi Ohguchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
https://doi.org/10.1115/1.2429714
Published Online: May 21, 2006
View Article titled, Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn ∕ 37 Pb and Sn ∕ 3 Ag ∕ 0.5 Cu Solder Alloys
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Topics: Alloys, Creep, Deformation, Lead-free solders, Solders, Stress
Journal Articles

Thermal Plastic-Elastic Analysis in Consideration of Metallurgical Microstructure

Tsuyoshi Takahashi, Senior Staff Engineer,, Yoshio Sugimura, Middle Grade Engineer,, Katsuhiko Sasaki, Associate Professor,
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2004, 126(1): 25–32.
https://doi.org/10.1115/1.1645875
Published Online: March 18, 2004
View Article titled, Thermal Plastic-Elastic Analysis in Consideration of Metallurgical Microstructure
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Topics: Casting, Cylinders, Data acquisition systems, Mechanical properties, Structural analysis, Porosity, Solidification, Aluminum alloys, Stress
Journal Articles

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 379–387.
https://doi.org/10.1115/1.1371927
Published Online: August 24, 1999
View Article titled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
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Topics: Alloys, Compression, Constitutive equations, Creep, Deformation, Simulation, Solders, Stress, Temperature, Tension
Journal Articles

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 164–169.
https://doi.org/10.1115/1.2792147
Published Online: September 1, 1996
View Article titled, Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
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Topics: Constitutive equations, Fatigue failure, Solders, Viscoplasticity, Alloys, Deformation, Density, Compression, Creep, Fatigue life
Journal Articles

Creep, Stress Relaxation and Biaxial Ratchetting of Type 304 Stainless Steel After Cyclic Preloading

Hiromasa Ishikawa, Katsuhiko Sasaki
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 1994, 116(2): 133–141.
https://doi.org/10.1115/1.2904263
Published Online: April 1, 1994
View Article titled, Creep, Stress Relaxation and Biaxial Ratchetting of Type 304 Stainless Steel After Cyclic Preloading
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Topics: Creep, Relaxation (Physics), Stainless steel, Stress, Plasticity, Aeroelasticity, Constitutive equations, Cycles, Shear (Mechanics), Shear stress