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Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

Caleb Anderson, Joshua Richey, Michael Fish, Todd Bandhauer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041104.
Paper No: EP-21-1102
https://doi.org/10.1115/1.4052360
Published Online: September 24, 2021
View Article titled, Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads
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Topics: Boiling, Heat, Stress, Temperature, Transients (Dynamics), Steady state, Heat flux, Vapors
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
Open the PDF for Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions in another window
Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Article titled, Modeling Thermal Microspreading Resistance in Via Arrays
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux