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Journal Articles

Effects of Brittleness on Crack Behaviors in Rock-Like Materials

X. P. Zhou, J. Bi, R. S. Deng, B. Li
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. July 2020, 48(4): 2829–2851.
Paper No: JTE20170595
https://doi.org/10.1520/JTE20170595
Published Online: July 1, 2020
View Article titled, Effects of Brittleness on Crack Behaviors in Rock-Like Materials
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Journal Articles

Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel

Y. Hwang, S. Deng
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. August 2008, 130(3): 031203.
https://doi.org/10.1115/1.2937763
Published Online: June 12, 2008
View Article titled, Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel
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Topics: Artificial neural networks, Gun barrels, Heat conduction, Heat flux, Temperature
Proceedings Papers

Low Temperature Wafer Bonding in Medium Vacuum

W. B. Yu, J. Wei, C. M. Tan, S. S. Deng
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 303-307, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60454
https://doi.org/10.1115/IMECE2004-60454
View Paper titled, Low Temperature Wafer Bonding in Medium Vacuum
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Topics: Bonding, Low temperature, Semiconductor wafers, Vacuum, Plasmas (Ionized gases), Temperature, Annealing, Bubbles, Contamination, Damage
Proceedings Papers

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, C. K. Wong
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 309-314, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60455
https://doi.org/10.1115/IMECE2004-60455
View Paper titled, Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer
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Topics: Bonding, Composite materials, Design, Hydrophilicity, Low temperature, Semiconductor wafers, Sol-gel processing
Proceedings Papers

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

J. Wei, S. S. Deng, C. M. Tan
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 225-229, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79263
https://doi.org/10.1115/IMECE2005-79263
View Paper titled, Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature
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Topics: Bonding, Coating processes, Coatings, Low temperature, Semiconductor wafers, Sol-gel processing, Bond strength, Silicon, Temperature, Bubbles
Journal Articles

Detection of Anabolic Steroids in Head Hair

X-S Deng, M.B., A Kurosu, M.D., DJ Pounder, M.B.
Journal: Journal of Forensic Sciences
Publisher: ASTM International
Article Type: Research-Article
J. Forensic Sci.. March 1999, 44(2): 343–346.
https://doi.org/10.1520/JFS14460J
Published Online: March 1, 1999
View Article titled, Detection of Anabolic Steroids in Head Hair
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Journal Articles

Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings

T. A. Reddy, S. Deng, D. E. Claridge
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research Papers
J. Sol. Energy Eng. February 1999, 121(1): 40–46.
https://doi.org/10.1115/1.2888141
Published Online: February 1, 1999
View Article titled, Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings
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Topics: Structures, Ventilation, Errors, Heating and cooling, Simulation, Stress, Thermal energy