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Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
https://doi.org/10.1115/1.4051754
Published Online: September 15, 2021
View Article titled, A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)
Includes: Supplementary data
Journal Articles

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041106.
Paper No: EP-19-1106
https://doi.org/10.1115/1.4047470
Published Online: June 26, 2020
View Article titled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
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Topics: Cooling, Experimental design, Ice, Temperature, Heat
Proceedings Papers

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6325
https://doi.org/10.1115/IPACK2019-6325
View Paper titled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
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Topics: Cooling, Experimental design
Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
https://doi.org/10.1115/1.4044359
Published Online: September 19, 2019
View Article titled, Packaging for Laser-Based White Lighting: Status and Perspectives
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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)
Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
https://doi.org/10.1115/1.4044624
Published Online: September 19, 2019
View Article titled, Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation
Journal Articles

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Ruikang Wu, Kai Wang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031001.
Paper No: EP-18-1080
https://doi.org/10.1115/1.4042981
Published Online: April 10, 2019
View Article titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
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Topics: Heat, Light-emitting diodes, Nanoparticles, Phosphors, Quantum dots, Silicones, Temperature, Shells, Simulation
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Article titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Open the PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging in another window
Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8301
https://doi.org/10.1115/IPACK2018-8301
View Paper titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure
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Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability
Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8211
https://doi.org/10.1115/IPACK2018-8211
View Paper titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
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Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter
Proceedings Papers

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8315
https://doi.org/10.1115/IPACK2018-8315
View Paper titled, Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio
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Topics: Atoms, Crystals, Molecular dynamics simulation, Surface roughness, Temperature
Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8210
https://doi.org/10.1115/IPACK2018-8210
View Paper titled, Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump
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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems
Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8225
https://doi.org/10.1115/IPACK2018-8225
View Paper titled, All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes
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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering
Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74195
https://doi.org/10.1115/IPACK2017-74195
View Paper titled, Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
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Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74196
https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
View Article titled, Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Bin Xie, Run Hu, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020803.
Paper No: EP-16-1020
https://doi.org/10.1115/1.4033143
Published Online: April 19, 2016
View Article titled, Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
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Topics: Light-emitting diodes, Packaging, Polymers
Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2016, 138(1): 010201.
Paper No: EP-16-1019
https://doi.org/10.1115/1.4032748
Published Online: March 10, 2016
View Article titled, Special Section on InterPACK 2015
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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards
Proceedings Papers

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48017
https://doi.org/10.1115/IPACK2015-48017
View Paper titled, Design, Fabrication and Characterization of a Mechanical Micropump
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Topics: Design, Manufacturing, Micropumps, Flow (Dynamics), Blades, Computational fluid dynamics, Emissions, Impellers, Pressure, Pumps
Proceedings Papers

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48032
https://doi.org/10.1115/IPACK2015-48032
View Paper titled, Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation
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Topics: Thermal conductivity, Alloys, Crystals, Gallium nitride, Mean free path, Size effect, Temperature
Proceedings Papers

A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity

Qi Chen, Run Hu, Yiman Wang, Huai Zheng, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A044, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48023
https://doi.org/10.1115/IPACK2015-48023
View Paper titled, A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity
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Topics: Phosphors, Sedimentation, Engineering simulation, Ray tracing, Simulation, Temperature