.... The multiple hot spots, multiple layers and combination problems are also studied in the current paper. The solutions can be applied to the thermal management of three-dimensional stacks of electronic devices, the interconnect layers and the thermoelectric devices. Multiple layers problem In each...

..., rate of fluid flow, and heat sink/source temperature are studied. 17 02 2009 15 03 2010 24 05 2010 24 05 2010 cooling flow heat exchangers heat pumps heat sinks heating Peltier effect testing thermoelectric devices water storage Peltier cooling thermal energy...